CHAMPAIGN, Ill. — You can think of it as origami – very high-tech origami.
Researchers at the University of Illinois have developed a technique for fabricating three-dimensional, single-crystalline silicon structures from thin films by coupling photolithography and a self-folding process driven by capillary interactions.
The films, only a few microns thick, offer mechanical bendability that is not possible with thicker pieces of the same material.