When engineers design devices, they must often join together two materials that expand and contract at different rates as temperatures change. Such thermal differences can cause problems if, for instance, a semiconductor chip is plugged into a socket that can't expand and contract rapidly enough to maintain an unbroken contact over time.
The potential for failure at such critical junctures has intensified as devices have shrunk to the nano scale, bringing subtle forces into play that tug at atoms and molecules, causing strains that are difficult to observe, much less avoid.